Síguenos en...

  • Facebook Page: 123760984335328
  • Twitter: inituji
  • YouTube: initchannel

Contacto







 

 

INIT > Actividad Científica > Publicaciones

Single-Shot Femtosecond Laser Ablation Of Wide-Field Irradiance Patterns Onto A Silicon Sample

Área de investigación: Óptica Año: 2017
Tipo de publicación: Artículo en conferencia
Autores:
Editor: IEEE
Páginas: 1
ISBN: 9781509067367
Resumen:
In this contribution we experimentally demonstrated femtosecond laser micro-processing of large arbitrary-shaped irradiance patterns in silicon without sample or beam scanning. This is mainly accomplished by carrying out spatial and temporal shaping of femtosecond pulses with the help of a phase-only spatial light modulator (SLM, PLUTO-NIR-II), and an acousto-optic programmable dispersive filter (Dazzler from FASTLITE). In particular, the spectral phase of the femtosecond pulse is changed by introducing different sets of dispersion parameters into the Dazzler, whereas the amplitude and spatial phase of the laser beam is controlled with a single phase mask encoded into the SLM. Each phase mask is designed following a specific method for encoding complex fields into a single phase element [1]. By using this diffraction-based method one can produce user-defined spatially uniform irradiance patterns with different spatial shapes at the surface of the silicon sample. Here, it should be mentioned that a suited setting of the position of the surface of the silicon sample with respect to the ablation plane is carried out by means of a multi-axis motorized stage (denoted by MS in Fig. 1). Before starting the micro-processing, the adequate laser fluence must be also determined. Then, in a single-shot regime controlled with a motorized shutter, the ablation process due to the interaction of above-mentioned irradiance patterns with the material surface is accomplished. Note that, under laser fluence range lower than 1 J/cm2 the dominate ablation mechanisms of spallation and fragmentation in metals [2] occur with minimal thermal or mechanical damages in the surrounding of the processed area. In addition, the lack of sequentially dot-by-dot scans over a sample considerably reduces the fabrication time and avoids boundary effects due to the ablation craters overlap.
Comentarios:
CLEO®/Europe-EQEC 2017. Munich (Alemanya). 25-06-2017

Catálogo de servicio

  Ayer tuvo lugar la presentación de los resultados de los dos proyectos seleccionados en la convocatoria "Prueba de Concepto" de 2016. Por parte del proyecto FiviPlay, Javier Traver y Mª Ángeles...
[+]
Se han publicado en el DOCV dos convocatorias de oferta pública para la selección de dos plazas de personal investigador del INIT, con contrato laboral temporal por obra y servicio...
[+]

Entrar



External job vacancies

Técnico Superior, especializado en procesamiento de imágenes usando librería gráfica OpenCV. Ubicación del trabajador: Edificio Instituto Universitarios de Investigación Avda. Severo Ochoa, 4 Parque Tecnológico de Andalucía. 29590-Málaga. Fecha límite de presentación de solicitudes: 24/03/2017 Para más información y solicitudes: http://www.uma.es/servicio-de-investigacion/noticias/ci-17-065/
[+]
El grupo VISILAB de la Universidad de Castilla-La Mancha en Ciudad Real oferta una plaza de postdoc para 1 año bajo el proyecto Europeo AIDPATH – Marie Curie Action IAPP.  Sería para trabajar en temas de clasificación y procesamiento de imágenes microscópicas. Más detalles en este enlace: link
[+]
We are seeking for two exceptional and passionate full-time Ph.D. students to work on two R&D projects jointly supervised by the University of Catania (Sicily, IT) and two involved partners (see all the details below).   The Image Processing Laboratory (IPLab) is part of the department of Mathematics and Computer Science of the
[+]